- Step height and dimensional measurement
- Characterizing wear and friction of mechanical parts
- Determining consistency of solder bump heights, e.g. on flip chips and other advanced packaging
- Correlating roughness measurements with materials properties, e.g. adhesion, corrosion, appearance
- Measuring the radius of curvature of microfluidic channels, optics, etc.
- Assessing bow on coated/processed wafers, e.g. MEMS fabrication
- Quantifying thickness of continuous, transparent films (i.e. no physical step is needed)
- High-throughput screening of multiple features on a die or wafer