Atomic Force Microscopy (AFM)
Atomic Force Microscopy (AFM) analysis provides images with near-atomic resolution for measuring surface topography. It is capable of quantifying surface roughness of samples down to the angstrom-scale. In addition to presenting a surface image, AFM analysis can also provide quantitative measurements of feature sizes, such as step heights and other dimensions. Additionally, advanced modes of atomic force microscopy measurements allow for the qualitative mapping of various other physical properties, such as adhesion, modulus, dopant distribution, conductivity, surface potential, electric field, and magnetic domains.
What is the use of Atomic Force Microscopy?
- Assessing wafers or thin films on wafers (e.g. SiO2, GaAs, SiGe, etc.) before and after processing
- Investigating processing effects (e.g. plasma treatment) on biomedical devices such as contact lenses, catheters and coated stents
- Examining the impact of surface roughness on adhesion
- Assessing trench shape/cleanliness on processed/patterned wafers
- Determining whether morphology is the source of surface hazes
- Mapping the distribution of activated carriers
- Characterizing the uniformity of thin conductive films
- Measuring step heights between domains on patterned wafers
Contact us at 800-366-3867 to discuss your AFM imaging needs.